General Co-Chairs
Emilio Calvanese Strinati, CEA-LETI, France
Kei Sakaguchi, Tokyo Institute of Technology, Japan
Thomas Haustein, Fraunhofer HHI, Germany
TPC Co-Chairs
Gia Khanh Tran, Tokyo Institute of Technology, Japan
Sergio Barbarossa, Sapienza University of Rome, Italy
Markus Dominik Mueck, Intel Deutschland GmbH, Germany
Valerio Frascolla, Intel Deutschland GmbH, Germany
Matti Latva-aho, University of Oulu, Finland
TPC Members
Zdenek Becvar, Czech Technical University in Prague, Czech
Antonio Capone, Politecnico di Milano, Italy
Konstantinos Dimou, Intel Labs, USA
Takeo Fujii, The University of Electro-Communications, Japan
Markus Dominik Mueck, Intel Deutschland GmbH, Germany
Valerio Frascolla, Intel Deutschland GmbH, Germany
Artur Hecker, Huawei Technologies, Germany
Jingon Joung, Chung-Ang University, Korea
Marios Kountouris, Huawei Technologies, France
Zihuai Lin, University of Sydney, Australia
David López-Pérez, Nokia Bell Labs, Ireland
David Mazzarese, Huawei Technologies, China
Loreto Pescosolido, CNR - Italian National Research Council, Italy
Nuno Pratas, Aalborg University, Denmark
Koji Yamamoto, Kyoto University, Japan
Other Reviewers
Kiyomichi Araki, Tokyo Institute of Technology, Japan
Itay Cnaan, Duke University, USA
Carlo Galiotto, Trinity College Dublin, Ireland
Adrian Garcia-Rodriguez, Nokia Bell Labs, Ireland
Giovanni Geraci, Nokia Bell Labs, Ireland
Michael Grimwood, Cohere Technologies, USA
Zakaria Hanzaz, University of Kaiserslautern, Germany
Amir H Jafari, Bell Labs Nokia, USA
Charles Kabiri, University of Rwanda, Rwanda
Shotaro Kamiya, Kyoto University, Japan
Janne Lehtomäki, University of Oulu, Finland
Chuan Ma, University of Sydney, Australia
Andreas Molisch, Cohere Technologies, USA
Takayuki Nishio, Kyoto University, Japan
Mai Ohta, Fukuoka University, Japan
Sina Shaham, University of Sydney, Australia
Hidekazu Shimodaira, NTT Docomo, Japan
Osamu Takyu, Shinshu University, Japan
Stephane Tessier, Ericsson, Sweden
Xiaopeng Wang, University of Sydney, Australia
Anna Wielgoszewska, Bell Labs Nokia, Ireland
Dionysis Xenakis, University of Athens, Greece
Shota Yamashita, Kyoto University, Japan
Osman N. C. Yilmaz, Ericsson Research, Finland
Jun Zhang, The Hong Kong University of Science and Technology, Hong Kong
Publicity Chairs
Kentaro Ishizu, NICT, Japan
Steering Committee
Hadi Baligh, Huawei Tech., Canada
Mehdi Bennis, University of Oulu, Finland
David Mazzarese, Huawei Technomogies, China
Seiichi Sampei, Osaka University, Japan
David Lopez-Perez, Bell Labs, Ireland
Holger Claussen, Bell Labs, alcatel-Lucent, Ireland
Advisory Board
Takayama Yamazato, Nagoya University, Japan
Antti Tolli, University of Oulu, Finland
Kenta Umebayashi, Tokyo University of Agriculture and Technology, Japan
Shinsuke Ibi, Osaka University, Japan
Merouane Debbah, SUPELEC, France
Jessica Oueis, CEA-LETI, France
Suguru Kameda, Tohoku University, Japan
Emilio Calvanese Strinati, CEA-LETI, France
Kei Sakaguchi, Tokyo Institute of Technology, Japan
Thomas Haustein, Fraunhofer HHI, Germany
TPC Co-Chairs
Gia Khanh Tran, Tokyo Institute of Technology, Japan
Sergio Barbarossa, Sapienza University of Rome, Italy
Markus Dominik Mueck, Intel Deutschland GmbH, Germany
Valerio Frascolla, Intel Deutschland GmbH, Germany
Matti Latva-aho, University of Oulu, Finland
TPC Members
Zdenek Becvar, Czech Technical University in Prague, Czech
Antonio Capone, Politecnico di Milano, Italy
Konstantinos Dimou, Intel Labs, USA
Takeo Fujii, The University of Electro-Communications, Japan
Markus Dominik Mueck, Intel Deutschland GmbH, Germany
Valerio Frascolla, Intel Deutschland GmbH, Germany
Artur Hecker, Huawei Technologies, Germany
Jingon Joung, Chung-Ang University, Korea
Marios Kountouris, Huawei Technologies, France
Zihuai Lin, University of Sydney, Australia
David López-Pérez, Nokia Bell Labs, Ireland
David Mazzarese, Huawei Technologies, China
Loreto Pescosolido, CNR - Italian National Research Council, Italy
Nuno Pratas, Aalborg University, Denmark
Koji Yamamoto, Kyoto University, Japan
Other Reviewers
Kiyomichi Araki, Tokyo Institute of Technology, Japan
Itay Cnaan, Duke University, USA
Carlo Galiotto, Trinity College Dublin, Ireland
Adrian Garcia-Rodriguez, Nokia Bell Labs, Ireland
Giovanni Geraci, Nokia Bell Labs, Ireland
Michael Grimwood, Cohere Technologies, USA
Zakaria Hanzaz, University of Kaiserslautern, Germany
Amir H Jafari, Bell Labs Nokia, USA
Charles Kabiri, University of Rwanda, Rwanda
Shotaro Kamiya, Kyoto University, Japan
Janne Lehtomäki, University of Oulu, Finland
Chuan Ma, University of Sydney, Australia
Andreas Molisch, Cohere Technologies, USA
Takayuki Nishio, Kyoto University, Japan
Mai Ohta, Fukuoka University, Japan
Sina Shaham, University of Sydney, Australia
Hidekazu Shimodaira, NTT Docomo, Japan
Osamu Takyu, Shinshu University, Japan
Stephane Tessier, Ericsson, Sweden
Xiaopeng Wang, University of Sydney, Australia
Anna Wielgoszewska, Bell Labs Nokia, Ireland
Dionysis Xenakis, University of Athens, Greece
Shota Yamashita, Kyoto University, Japan
Osman N. C. Yilmaz, Ericsson Research, Finland
Jun Zhang, The Hong Kong University of Science and Technology, Hong Kong
Publicity Chairs
Kentaro Ishizu, NICT, Japan
Steering Committee
Hadi Baligh, Huawei Tech., Canada
Mehdi Bennis, University of Oulu, Finland
David Mazzarese, Huawei Technomogies, China
Seiichi Sampei, Osaka University, Japan
David Lopez-Perez, Bell Labs, Ireland
Holger Claussen, Bell Labs, alcatel-Lucent, Ireland
Advisory Board
Takayama Yamazato, Nagoya University, Japan
Antti Tolli, University of Oulu, Finland
Kenta Umebayashi, Tokyo University of Agriculture and Technology, Japan
Shinsuke Ibi, Osaka University, Japan
Merouane Debbah, SUPELEC, France
Jessica Oueis, CEA-LETI, France
Suguru Kameda, Tohoku University, Japan